| Microarchitecture |
Comet Lake |
| Processor core |
Comet Lake-S |
| Core steppings |
G1 (SRH3C)
Q0 (SRH78) |
| Manufacturing process |
0.014 micron |
| Data width |
64 bit |
| The number of CPU cores |
6 |
| The number of threads |
12 |
| Floating Point Unit |
Integrated |
| Level 1 cache size |
6 x 32 KB 8-way set associative instruction caches
6 x 32 KB 8-way set associative data caches |
| Level 2 cache size |
6 x 256 KB 4-way set associative caches |
| Level 3 cache size |
12 MB 16-way set associative shared cache |
| Physical memory |
128 GB |
| Multiprocessing |
Uniprocessor |
| Extensions and Technologies |
- MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
- AES / Advanced Encryption Standard instructions
- AVX / Advanced Vector Extensions
- AVX2 / Advanced Vector Extensions 2.0
- BMI / BMI1 + BMI2 / Bit Manipulation instructions
- F16C / 16-bit Floating-Point conversion instructions
- FMA3 / 3-operand Fused Multiply-Add instructions
- EM64T / Extended Memory 64 technology / Intel 64
- HT / Hyper-Threading technology
- VT-x / Virtualization technology
- VT-d / Virtualization for directed I/O
- TBT 2.0 / Turbo Boost technology 2.0
|
| Security Features |
- NX / XD / Execute disable bit
- MPX / Memory Protection Extensions
- SGX / Software Guard Extensions
- SMAP / Supervisor Mode Access Prevention
- SMEP / Secure Mode Execution Protection
|
| Low power features |
- Core C1/C1E, C3, C6, C7, C8, C9 and C10 states
- Package C3, C6, C7, C8, C9 and C10 states
- Enhanced SpeedStep technology
|
| Integrated peripherals / components |
| Display controller |
- 3 displays
- DVI / DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
|
| Integrated graphics |
GPU Type: Intel UHD 630
Graphics tier: GT2
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1100 |
| Memory controller |
The number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR4-2666
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 42.7 |
| Other peripherals |
- Direct Media Interface 3.0 (4 lanes)
- PCI Express 3.0 interface (16 lanes)
|
| Electrical / Thermal parameters |
| Minimum/Maximum operating temperature |
0°C (case) - 71.3°C (case)
100°C (junction) |
| Thermal Design Power |
65 Watt |
