Microarchitecture |
Kaby Lake |
Processor core |
Kaby Lake-S |
Core stepping |
B0 (SR32W) |
Manufacturing process |
0.014 micron |
Data width |
64 bit |
The number of CPU cores |
4 |
The number of threads |
4 |
Floating Point Unit |
Integrated |
Level 1 cache size |
4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches |
Level 2 cache size |
4 x 256 KB 4-way set associative caches |
Level 3 cache size |
6 MB 12-way set associative shared cache |
Physical memory |
64 GB |
Multiprocessing |
Uniprocessor |
Features |
- MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
- AES / Advanced Encryption Standard instructions
- AVX / Advanced Vector Extensions
- AVX2 / Advanced Vector Extensions 2.0
- BMI / BMI1 + BMI2 / Bit Manipulation instructions
- F16C / 16-bit Floating-Point conversion instructions
- FMA3 / 3-operand Fused Multiply-Add instructions
- EM64T / Extended Memory 64 technology / Intel 64
- NX / XD / Execute disable bit
- VT-x / Virtualization technology
- VT-d / Virtualization for directed I/O
- TBT 2.0 / Turbo Boost technology 2.0
- TSX / Transactional Synchronization Extensions
- MPX / Memory Protection Extensions
- SGX / Software Guard Extensions
|
Low power features |
- Core C1/C1E, C3, C6, C7 and C8 states
- Package C2, C3, C6, C7 and C8 states
- Enhanced SpeedStep technology
|
Integrated peripherals / components |
Display controller |
- 3 displays
- DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
|
Integrated graphics |
GPU Type: Intel HD 630
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1000 |
Memory controller |
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-2133, DDR4-2400
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 38.4 |
Other peripherals |
- Direct Media Interface 3.0 (4 lanes)
- PCI Express 3.0 interface (16 lanes)
|
Electrical / Thermal parameters |
Maximum operating temperature |
100°C |
Thermal Design Power |
65 Watt |